Industrial Solutions
Provide customers with the most appropriate waterjet process solution.
Industrial Solutions>Semiconductor
Semiconductor
Machining
Features
- TQ300 : A specialized waterjet model for semiconductor materials machining solution
- Semiconductor parts material machining like Quartz, Silicon
- Minimize taper by taper compensation
- Equipped special on/off for brittle material
- Minimize material cracking and chip generation with unclog abrasive supply control technology
- Dual dial type abrasive mini hopper with high/low pressure switching
- Ultra-high pressure waterjet for brittle materials
Removal
WJS
Features
The water condensed at high pressure is jetted on the surface of the material to remove chemical substances and coatings.
- No deformation from heat, friction & corrosion
- Time saving up to 10 times faster than chemicals
- Single process to removes all coating types
- Eco friendly : releases no pollutant
| Stripping range | |
|---|---|
| Base material | Coat material |
| Inconel | Rubber |
| Titanium | Abradable & Polymers |
| Titanium Aluminide | Metal & Alloys |
| Stainless steel | Ceramics |
| Aluminum | Carbide |
| Steel... | |
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